发明名称 METHOD OF MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To manufacture a wiring board at with a short TAT. SOLUTION: The wiring of the wiring board is formed by exposure processing using a photomask M1 having light shielding body patterns 2 including at least, a particulate material and a binder.
申请公布号 JP2002221801(A) 申请公布日期 2002.08.09
申请号 JP20010019774 申请日期 2001.01.29
申请人 HITACHI LTD 发明人 TANAKA TOSHIHIKO;KUBO SEIJI;HATTORI KOJI
分类号 G03F1/54;G03F1/56;G03F1/70;G03F7/20;H01L21/48;H01L23/12;H05K3/00;H05K3/36;H05K3/46 主分类号 G03F1/54
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