| 摘要 |
PROBLEM TO BE SOLVED: To provide a positive type photosensitive resin composition excelling in PED stability and prifile, significantly improved in the developing faulty problems and free from any shortening on the line pattern end (lengthwise direction), when using far ultraviolet rays, especially ArF excimer laser beam as its exposure illuminant. SOLUTION: The positive type photosensitive resin composition is characterized by containing (A) a compound generating acid by irradiation of an active light ray or a radial ray, (B) a resin increasing its rate of solution for an alikali developer by the action of an acid having specified cycle units, and (C) a nitrogenous compound having a specific partial molecular structure. |
