LASER CLEANING PROCESS FOR SEMICONDUCTOR MATERIAL

摘要

A laser cleaning process is disclosed for cleaning the surface of materials, such as semiconductor wafers (4) and the like, which process can be performed at atmospheric pressure. The process includes the steps of providing (40) a structure with a surface having undesirable contaminant particles thereon, wetting (44) the surface with a liquid including reactive or non-reactive liquids, and irradiating (47) the surface using photon energy with sufficient energy to remove the wetting liquid and the undesirable material.