A STACKABLE MICROCIRCUIT LAYER FORMED FROM A PLASTIC ENCAPSULATED MICROCIRCUIT AND METHOD OF MAKING THE SAME

摘要

A stackable microcircuit layer formed from a plastic encapsulated microcircuit (PEM) and a method of making the PEM by providing PEM contains a microcircuit (210) with in an encapsulant (310) and modifying the PEM to expose conductive members (270) which is connected to the microcircuit's bonding pads (212), reroute metallization is applied to connect the conductive members (270) which exposed by grinding to an edge of the modified PEM (300) stacking to form an a assembly (450).