| 摘要 |
A technique for monitoring the alignment of groups of spring-loaded pins extending from a test head of an automatic component tester with conductive pads for receiving the spring-loaded pins includes a printed circuit board having an array of resistive pads. The resistive pads have substantially uniform sheet resistivity across their surfaces and have at least one electrode extending therefrom. The printed circuit board is placed against the spring-loaded pins in place of the conductive pads, so that the pins make contact with the resistive pads. When a pin makes contact with a pad, it forms an impedance with each electrode of the pad. By measuring each impedance, the location of the pin relative to the pad can be determined. Impedance measurements can be conducted at high speed under computer control. In addition, measurement results can be stored and analyzed for diagnosing and predicting faults due to misalignments of pins to pads.
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