| 摘要 |
To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to an integrated heat spreader (IHS) through a high capacity thermal spreader formed of diamond, a diamond composite, or graphite. In one embodiment, a diamond layer is grown on the IHS. In another embodiment, a diamond layer is separately formed and affixed to the IHS and/or to the die through soldering or through a room temperature surface activated bonding (SAB) process. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.
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