| 摘要 |
PURPOSE: A semiconductor device, a production method therefor, and an electrophotographic apparatus are provided to reduce a production cost including a material cost. CONSTITUTION: An IC chip(2) is mounted on the IC chip supporting section(1b), and connecting terminals of the IC chip(2) are electrically connected to the connecting terminals(1c) provided in both ends of the coil pattern section(1a) with gold or aluminum wires(4) by wire bonding. An encapsulating resin material(3) encapsulates the coil pattern section(1a), the IC chip supporting section(1b), the connecting terminals(1c), the IC chip(2), and the wires(4). The encapsulating resin material(3) fixes the coil pattern section(1a), the IC chip supporting section(1b), the connecting terminals(1c), the IC chip(2), and the wires(4) to integrate them into a plate-like IC tag. |
