发明名称 MANUFACTURE OF RESIN SEAL TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To form a resin insulating film on the rear of a heat dissipation plate in uniform thickness without damaging appearance and breakdown strength by shaping a sheathing resin material molded onto the whole surface of heat dissipation the plate twice. CONSTITUTION:A sheathing resin material is shaped in such a manner that sections except a non-element fixing side rear in at least a heat dissipation plate are molded with a first resin material and residual sections including the rear of the heat dissipation plate are molded with a second resin material. Accordingly, when the sheathing resin material is formed through two-time molding, the rear of the heat dissipation plate is brought into contact with the inner surface of the cavity of a molding die and the heat dissipation plate can be clamped directly by the die on first molding, and the partial sheathing resin material shaped through first molding can be utilized for holding the heat dissipation plate in the cavity of the die on second molding, thus easily equalizing the film thickness of a resin insulating film formed onto the rear of the heat dissipation plate on second molding.
申请公布号 JPS63211638(A) 申请公布日期 1988.09.02
申请号 JP19880002776 申请日期 1988.01.08
申请人 NEC HOME ELECTRONICS LTD 发明人 KOSEKI TAKAYUKI
分类号 H01L23/28;H01L21/56;H01L23/29;H01L23/31 主分类号 H01L23/28
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