| 摘要 |
The present invention generally provides a thermally-activated, shorting-diode switch whose composite diode structure possesses a non-operationally-alterable junction path, and whose diode shorting is effectuated by temperature-sensitive companion elements. The diode structure includes a semiconductor diode element to which associated first and second lead substructures are both unalterably connected. When activated by the increased temperatures experienced by the diode structure upon conduction, the shorting elements establish a direct, diode-bypass connection between the lead substructures. In a first more-specific embodiment, the shorting mechanism encompasses a solder preform which melts and flows over the diode structure when conduction-interval temperatures are generated. A second more-specific embodiment alternatively employs a temperature-responsive deformation mechanism which upon activation deflects a cantilevered segment of the first lead into diode-bridging contact with a companion segment of the second lead. |
