发明名称 |
High density interconnect multichip module stack and fabrication method |
摘要 |
A method for fabricating a substrate package for a high density interconnect multichip module stack comprises: providing a substrate having holes extending therethrough and having a bottom surface with metallization situated thereon; providing a metal sheet having grooves extending therethrough; attaching the metal sheet to the bottom surface of the substrate; attaching metal plugs through the holes to the metal sheet; and removing portions of the substrate to expose the metal plugs and separate the metal sheet into a plurality of segments defined by the grooves. |
申请公布号 |
US6429381(B1) |
申请公布日期 |
2002.08.06 |
申请号 |
US20010681555 |
申请日期 |
2001.04.27 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
SAIA RICHARD JOSEPH;WOJNAROWSKI ROBERT JOHN;WEAVER, JR. STANTON EARL;DUROCHER KEVIN MATTHEW;KAPUSTA CHRISTOPHER JAMES;SABATINI JAMES ENRICO |
分类号 |
H01L23/367;H01L23/48;H01L25/065;H05K1/03;H05K3/00;H05K3/32;H05K3/40;H05K3/46;(IPC1-7):H05K1/03 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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