发明名称 POSITIONING AND AUTOMATIC-HANDLING MECHANISM FOR TREATED SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To reduce the number of part items to reduce total cost and to save a space, enhance durability, and enhance maintainability of reproducibility. SOLUTION: This mechanism is formed to make a working unit 12 provided with a driving means 22 drive-controlled by a motor 23, a positioning means 32 wherein a camera 33 is elevation-controlled in a proper position determined in a relation with respect to a treated substrate P via the driving means 22, and an automatic handling means 52 wherein the driving means 22 is drive- controlled based on positional information acquired in the proper position by the positioning means 32 to elevation-control freely motion of the treated substrate P to a working point, arranged freely in a main body.
申请公布号 JP2002219678(A) 申请公布日期 2002.08.06
申请号 JP20010015252 申请日期 2001.01.24
申请人 HIOKI EE CORP 发明人 UEHARA SATOSHI
分类号 B25J13/08;B25J9/02;B25J17/02;H01L21/52;H05K13/04 主分类号 B25J13/08
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