发明名称 |
Wiring structures containing interconnected metal and wiring levels including a continuous, single crystalline or polycrystalline conductive material having one or more twin boundaries |
摘要 |
The present relates to a method of fabricating wiring structures which contain a continuous, single crystalline conductive material extending through the structure. This is achieved in the present invention by utilizing an open-bottomed via liner structure.
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申请公布号 |
US6429519(B1) |
申请公布日期 |
2002.08.06 |
申请号 |
US19990277699 |
申请日期 |
1999.03.26 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
UZOH CYPRIAN E. |
分类号 |
H01L21/3205;H01L21/768;H01L23/522;H01L23/532;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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