| 摘要 |
PROBLEM TO BE SOLVED: To provide a seal molding apparatus wherein no slide resistance occurs in respect to plungers and a pressure holding process is free of a pressure loss, while occurrence of unfilling or voids is suppressed. SOLUTION: The plungers 4 for injecting and filling a powder-like or tablet- shaped molding resin in a lower cavity 1 and an upper cavity 14 and movable plungers 17 for pressing and holding the molding resin with a prescribed hydraulic pressure at arbitrary timing, corresponding to the plungers 4 on injection of the resin, just before completion of filling or after the filling, on the occasion when a strip-shaped or hoop-shaped lead frame 11 whereon forming elements 10 constituting molded bodies 20 are placed is subjected to resin seal molding by molding tools, are provided in the apparatus.
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