发明名称 APPARATUS FOR FIXING AND PACKAGING FLAT WAVEGUIDE DEVICE MODULE
摘要 PURPOSE: An apparatus for fixing and packaging a flat waveguide device module is provided, which is insensitive to conditions like an external impact and has a good reliability characteristics. CONSTITUTION: The apparatus for fixing and packaging the flat waveguide device module comprises an optical device(100), and a housing(140) where the optical device is installed, and an elastic plate(200) which is located by crossing a top of the optical device and pushes the optical device by an elastic force by being attached to the housing. The elastic plate and the housing are attached by connecting both sides of the elastic plate to a connection part of a screw(210) and a screw hole(220) comprised in the housing. The elastic plate is formed with a sheet spring of a steel or a plastic material. And a heating plate(120) and a heat source(130) are comprises in a bottom of the optical device.
申请公布号 KR20020063693(A) 申请公布日期 2002.08.05
申请号 KR20010004280 申请日期 2001.01.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, JIN SU;KWON, O DAL
分类号 G02B6/42;(IPC1-7):G02B6/42 主分类号 G02B6/42
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