发明名称 WIRE BONDING CAPILLARY AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a high-purity polycrystalline alumina wire bonding capillary which is improved so as to have higher physical properties such as strength (bending strength), abrasive resistance, hardness, and corrosion resistance than a conventional wire bonding capillary and reduced in cost as much as possible, and to provide its manufacturing method. SOLUTION: High-purity alumina which is composed of polycrystalline alumina that is 9.99 mass% or above in alumina content, 2 μm or below in a crystal grain diameter, 0.5% or below in porosity, and 3.98/cm3 or above in density is made to be of an average grain diameter 0.1 to 0.25 μm, a primary grain diameter 0.05 to 0.25 μm, and a specific surface area 10 to 20 m2/g or above, and α-alumina powder of alumina content 99.99 mass% or above and the above high-purity alumina are formed into a high-purity polycrystalline alumina wire bonding capillary by sintering carried out in a temperature range of from 1200 to 1400 deg.C.
申请公布号 JP2002217228(A) 申请公布日期 2002.08.02
申请号 JP20010012891 申请日期 2001.01.22
申请人 ARIMA KENICHI 发明人 ARIMA KENICHI
分类号 H01L21/60 主分类号 H01L21/60
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