发明名称 WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To solve the problem that a lead terminal cannot be strongly brazed to a second wiring layer that is electrically connected to a first wiring layer. SOLUTION: In the wiring board 6 where the first wiring layer 2 and the second wiring layer 3 where a metal member 8 is to be brazed are formed on the surface of an insulating substrate 1, a plated layer is deposited on the surface of the first and second wiring layers 2 and 3, and the first and second wiring layers 2 and 3 are electrically connected via an inner wiring layer 4 that is formed in the insulating substrate 1.</p>
申请公布号 JP2002217336(A) 申请公布日期 2002.08.02
申请号 JP20010013709 申请日期 2001.01.22
申请人 KYOCERA CORP 发明人 HOSOI YOSHIHIRO;FUKUDA YASUO
分类号 H05K1/09;H01L23/12;H01L23/14;H01L23/50;H05K1/11;H05K3/24;H05K3/46;(IPC1-7):H01L23/14 主分类号 H05K1/09
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