| 摘要 |
PURPOSE:To exfoliate a semiconductor wafer from an abrasive board and hold it with catches by inserting two or more catches being distance-adjustable from both surfaces of a semiconductor wafer, between the semiconductor wafer and the abrasive board. CONSTITUTION:A catch 10 is moved backward so that the distance between catches 10 and 11 may become larger than a semiconductor wafer 21 by rotating the knob 5. After that, the catches 10 and 11 are applied to an abrasive board 22. Then, the distance between catches 10, 11 is narrowed by rotating the knob 5 reversely, and the periphery of the wafer 21 is grasped. As the distance between the catches 10, 11 is made narrower, exfoliation occurs inside wax 13 at the peripheral part of the wafer 21 grasped with the catches, in a state that the wax 13 softened with the inclined planes of the catches 10, 11 attaches to the wafer 21. This makes the wafer 21 exfoliate from the abrasive board 22 and the wafer 21 is held with the catches 10, 11.
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