| 摘要 |
PROBLEM TO BE SOLVED: To provide a pretreatment method, for a plating operation to a non- through hole or a through-hole in a printed-wiring board, in which the through hole or a blind via hole of high connection reliability can be obtained easily, even when a conductor is irradiated directly with a UV laser so as to bore and form the through-hole or the nonthrough-hole. SOLUTION: Before a plating treatment, a soft etching treatment is executed. A deposited conductor component 10, which is melted and stuck to the opening circumference 9 of the hole, is removed through irradiation 4 with a UV laser, and a resin remaining film 7 is exposed. Then, it is subjected to desmearing treatment, and the film 7 is removed. After that, a soft etching treatment is executed, and a conductor surface 8 is surface-adjusted.
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