| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device which is capable of reducing its manufacturing cost with maintenance ease. SOLUTION: A substrate 1 is placed on a lower open variable cavity 7, the top surface of the substrate 1 and the top surface of a lower open cavity 6 are aligned with each other by a position sensor 9, the depth of a cavity is set by an upper open variable cavity 5, and furthermore a molding resin 3 is injected between the upper open variable cavity 5 and the substrate 1.
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