| 摘要 |
PROBLEM TO BE SOLVED: To prevent peeling of an anisotropic conducting film which is to be generated, simultaneously with peeling of a protective film of the anisotropic conducting film, in flip-chip mounting using the anisotropic conducting film. SOLUTION: Bonding strength is increased by forming a pattern 4 for bonding in a belt type on a peripheral part in a region on which the anisotropic conducting film 3 is stuck. The same material as that of electrode patterns 2, which are wired in a region on which a bare IC is to be mounted, is used as material of the pattern 4, so that the height of the pattern 4 is made identical to that of the electrode patterns 2, contact area between a substrate 1 and the anisotropic conducting film 3 is enlarged, and bonding strength is increased. |
