| 摘要 |
PROBLEM TO BE SOLVED: To overcome a problem that although a conventional chuck has a cushioned property by using a porous ceramic or a rubber-like material, if a semiconductor wafer has slight tapers or irregularities in its thickness, a polish having an ultra-high accuracy uniformity cannot be realized since they are directly reflected to the polishing accuracy, and moreover, polishing sags occur in the peripheral edge of the semiconductor wafer. SOLUTION: This chuck for a polishing apparatus comprises a chuck base 1 having a concave portion on the undersurface, a gelatinous layer 2 arranged on the bottom of the concave portion of the chuck base 1, a chuck plate 3 laminated on the gelatinous layer 2, a back pad 4 laminated on the chuck plate 3, a semiconductor wafer W attached on the back pad 4, a wafer holder 5 arranged in the periphery of the semiconductor wafer W, an air bag 6 inserted between the wafer holder 5 and an edge of the chuck base 1 and an air supply route 7 arranged in the chuck base 1 connecting the air bag 6 with an air supply source. |
