| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for forming a modular component by directly packaging a semiconductor bare chip on a printed circuit board without accommodating in a package, and to provide a method for packaging the semiconductor bare chip and passive components by bringing them much closer. SOLUTION: After a surface-mounting component 1 is positioned on the printed circuit board 3 that is coated with solder paste 2, the component 1 is mounted and is passed through a reflow, thus melting the solder paste 2, and connecting and fixing the surface-mounting component 1 on the printed circuit board 3. After the printed circuit board 3 is washed, a thermosetting resin 7 is heated and pressed via a rubber sheet 6 for applying to the printed circuit board 3. After a plurality of semiconductor bare chips 9 is positioned on the printed circuit board 3, they are mounted via the thermosetting resin 7. Finally, the plurality of semiconductor bare chips 9 is heated and pressed simultaneously for connecting and fixing to the printed circuit board 3.</p> |
