发明名称 HARDWARE FOR PROCESSING ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a member for manufacturing an electric component having good dimensional accuracy being not liable to be affected at its dimensional accuracy by a temperature, a light weight and excellent chemical resistance and not liable to elute an organic material or the like, and a method for manufacturing the same. SOLUTION: In the manufacturing of a conductor a liquid-crystal display element and the like, an electronic-component processing hardware, such as a carrier, a pipe, a tube, a tank and the like used for the processing such as various-type chemical treatment, degreasing, washing and the like of a silicon wafer, a glass board and the like, and an electronic-component processing material, such as an IC tray and a carrier tape for arranging the supplying an electronic component for automatically mounting the electronic component to a printed-circuit board and a hybrid IC, and an electronic-component protective separation film held by the tray and tape, are made of a thermoplastic saturated norbornene resin having a load deflecting temperature of 70 deg.C of 18.6 kgf/cm2 and having excellent heat resistance, chemical resistance, organic matter low eluting properties and the like.
申请公布号 JP2002217279(A) 申请公布日期 2002.08.02
申请号 JP20010322611 申请日期 2001.10.19
申请人 NIPPON ZEON CO LTD 发明人 YUKISHIGE HIDENORI;TAKAHASHI SHINICHI;OBARA TEIJI;NATSUUME YOSHIO
分类号 B65D85/86;C08J7/02;C08K3/00;C08K5/10;C08L45/00;C08L65/00;H01L21/673;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65D85/86
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