| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which ooze-out of solder due to thermal stress and malfunction caused by ooze-out of solder are suppressed. SOLUTION: The semiconductor device comprises a semiconductor chip 1, an interposer electrode 3 being connected with the semiconductor chip 1 through solder bumps 2, and an interposer substrate 4 having external terminals wherein these semiconductor chip 1 and interposer electrode 3 are resin sealed on the interposer substrate 4 and the interposer electrode 3 is provided with vacant holes 11.
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