| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method of a conducting material connecting component on a substrate, wherein reliability of mounting is not deteriorated by foreign objects existing on a back of the substrate on which the component is to be mounted, by using anisotropic conducting material. SOLUTION: In this mounting method in which the conducting material connecting component 37 is mounted on the substrate 18 by using the anisotropic conducting material 40, the anisotropic conducting material 40 is disposed on the prescribed position on the substrate 18, and the conducting material connecting component 37 is mounted on the anisotropic conducting material 40. The back side of a region in the substrate 18, on which region the conducting material connecting component 37 is to be mounted, is cleaned by using a cleaning mechanism 60 having a cloth 61 for cleaning which gyrates on a prescribed orbit as an endless belt. The conducting material connecting component 37 is fixed by pressure on the substrate 18 sandwiching the anisotropic conducting material 40.
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