| 摘要 |
PROBLEM TO BE SOLVED: To obtain a manufacturing device of a multilayer substrate which readily enables highly precise positioning. SOLUTION: A first mark of a substrate P1 is obtained by a camera 32 and a position of a first mark is obtained by image processing, and rough positioning is carried out by moving a suction plate 23, so that the position is at the predetermined position. Then, the substrate P1 is made free of the suction plate 23, and the substrate P1 is sucked to a suction plate 84 and moved to be disposed opposite to a suction plate 72. Then, the substrate P1 of the suction plate 84 is made free, and the substrate P1 is sucked by means of the suction plate 72. Thereafter, a first mark is imaged by a camera 62 and is subjected to image processing. After a positioned is obtained and stored in a storage part, rough positioning is carried out as mentioned above, by using the substrate P2 having a second mark. Then, a second mark is imaged by the camera 62 and is subjected to image processing, a positioned is obtained, and precise positioning of the substrate P1 is carried out by moving the suction plate 72, so that a second mark coincides with a position stored in a storage part. |
