发明名称 Thin film bonding method and optical disk bonding method and apparatus using the same
摘要 A thin film bonding method for bonding a thin film to an target surface by using an adhesive agent includes the steps of: applying the adhesive agent on the target surface and mounting the thin film on the adhesive agent; applying a a fluid pressure on the target surface and the thin film from a central portion to an circumference according to lapse of time, so as to allow the thin film and the target surface to be bonded partially; and hardening the adhesive agent. The compressive force using the fluid having a magnetic force in the thin film bonding proceeds in a spiral form from the central portion to the circumference of the disk according to lapse of time, so that the air trap existing in the adhesive agent can be effectively removed, and thus, the flatness of the disk can be prevented from degradation due to the air trap.
申请公布号 US2002100543(A1) 申请公布日期 2002.08.01
申请号 US20020058600 申请日期 2002.01.25
申请人 LG ELECTRONICS INC. 发明人 KIM MYONG RYONG;JEONG TAE HEE
分类号 C09J5/00;B29C65/00;B29C65/48;B32B37/12;G11B7/24;G11B7/26;(IPC1-7):B32B31/00 主分类号 C09J5/00
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