发明名称 |
ADHESIVE-COATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND PRINTED CIRCUIT BOARD BOTH OBTAINED WITH THE SAME |
摘要 |
A resin coated copper foil obtained by disposing on one side of a copper foil a layer of an adhesive composition having as essential components (a) an epoxy resin, (b) a polyfunctional phenol, (c) a curing accelerator as required, and (d) a compound having a triazine ring or an isocyanuric ring, has low water absorption, high heat resistance and good adhesion to the copper foils, and by using this resin coated copper foil it is possible to obtain a copper-clad laminate and a printed circuit board having excellent properties. |
申请公布号 |
EP1146101(A4) |
申请公布日期 |
2002.07.31 |
申请号 |
EP19990959924 |
申请日期 |
1999.12.20 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
ARATA, MICHITOSHI;TAKANO, NOZOMU;KOBAYASHI, KAZUHITO |
分类号 |
C08G59/62;C09J7/02;C09J163/00;H05K3/38;H05K3/46 |
主分类号 |
C08G59/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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