发明名称 CONDUCTIVE RESIN COMPOSITION AND CONDUCTIVE MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a conductive resin composition having good conductivity, moldability and mechanical strength, and a conductive molding. SOLUTION: The resin composition is obtained by mixing (a) a base material comprising a thermoplastic resin or elastomer with (b) a low-melting metal having a melting point of 300 deg.C or lower, (c) a metal powder, and (d) a carbonaceous filler. The conductive molding is made from the composition.
申请公布号 JP2002212443(A) 申请公布日期 2002.07.31
申请号 JP20010014056 申请日期 2001.01.23
申请人 MITSUBISHI PLASTICS IND LTD 发明人 HAYASHI TATSUYA;HIJIYA SHINJI
分类号 C08J5/00;C08J5/18;C08K3/04;C08K3/08;C08K7/06;C08L101/00;H01B1/00;H01B1/22;H01B1/24;(IPC1-7):C08L101/00 主分类号 C08J5/00
代理机构 代理人
主权项
地址