发明名称 |
CONDUCTIVE RESIN COMPOSITION AND CONDUCTIVE MOLDING |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive resin composition having good conductivity, moldability and mechanical strength, and a conductive molding. SOLUTION: The resin composition is obtained by mixing (a) a base material comprising a thermoplastic resin or elastomer with (b) a low-melting metal having a melting point of 300 deg.C or lower, (c) a metal powder, and (d) a carbonaceous filler. The conductive molding is made from the composition.
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申请公布号 |
JP2002212443(A) |
申请公布日期 |
2002.07.31 |
申请号 |
JP20010014056 |
申请日期 |
2001.01.23 |
申请人 |
MITSUBISHI PLASTICS IND LTD |
发明人 |
HAYASHI TATSUYA;HIJIYA SHINJI |
分类号 |
C08J5/00;C08J5/18;C08K3/04;C08K3/08;C08K7/06;C08L101/00;H01B1/00;H01B1/22;H01B1/24;(IPC1-7):C08L101/00 |
主分类号 |
C08J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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