Single substrate microwave radar transceiver including flip-chip integrated circuits.

摘要

A microwave radar transceiver assembly (30) includes a monolithic microwave integrated circuit (MMIC) chip 58 having coplanar waveguide transmission lines (100,102,104) formed on the same surface (58a) as the electronic elements thereof. Coplanar waveguide transmission lines (68,70,72) are also formed on a surface (62a) of a substrate (62). Planar transmitting and receiving antenna elements (88,90) are formed on the opposite surface (62b) of the substrate (62), and interconnected with the transmission lines (68,70,72) by vertical interconnects (92,94) which extend through the substrate (62). The transceiver chip (58), in addition to signal processing and power conditioning chips (56,60), are mounted on the substrate (62) in a flip-chip arrangement, with the respective surfaces (58a,62a) on which the transmission lines (100,102,104;68,70,72) are formed facing each other. Electrically conductive bumps (106,108,110) are formed on portions of the transmission lines (100,102,104) of the chips (56,58,60) which are to be interconnected with the transmission lines (68,70,72) of the substrate (62), and solder (114) is formed on the portions of the transmission lines (68,70,72) of the substrate (62) which are to be interconnected with the transmission lines (100,102,104) of the chips (56,58,60). The chips (56,58,60) are aligned on the substrate (62), and the assembly is heated to fuse the solder and interconnect the bumps (106,108,110) on the chips (56,58,60) with the transmission lines (68,70,72) on the substrate (62) in an integral operation. The bumps (106,108,110) provide spacing between the mating surfaces (58a,62a) of the substrate (62) and chips (56,58,60), and isolation between electronic elements on the chips (56,58,60).