| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of simply inspecting the mechanical strength of a thin film of a sensor. SOLUTION: Flow sensors 10 having holes 3 and thin films 4 across the openings of the holes 3 are formed on a substrate 1. In this condition, a pressure is applied to each thin film 4, those sensors 10 having the thin films 4 broken by the applied pressure are regarded as defectives and other sensors 10 having the thin films 4 not broken are regarded as non-defectives, and only the latter sensors are used as flow sensors 10.</p> |
