发明名称 |
Low profile interconnect structure |
摘要 |
<p>Low profile interconnect structure includes an electronic circuit module with a plurality of mounting areas and a plurality of electrical contact areas defined by the mounting surface. The plurality of mounting areas are spaced a first distance from a mounting and interconnect surface parallel to and spaced from the mounting surface and the plurality of electrical contact areas are spaced a second distance, less than the first distance, from the mounting and interconnect surface. Large solder balls are used between the mounting areas and the mounting and interconnect surface to form a solid mount and smaller solder members are used for electrical interconnections. <IMAGE></p> |
申请公布号 |
EP1107655(A3) |
申请公布日期 |
2002.07.31 |
申请号 |
EP20000125898 |
申请日期 |
2000.11.27 |
申请人 |
MOTOROLA, INC. |
发明人 |
HUANG, RONG-FONG;FU, CHIA-YU |
分类号 |
H01L21/60;H01L23/48;H01L23/498;H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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