| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic substrate in which pores existing on the surface have a small diameter and a wiring pattern can be deposited without causing any open circuit or short circuit. SOLUTION: The ceramic substrate principally comprises 96-99 wt.% of Al2O3 and the remainder principally comprises SiO2 and MgO wherein the weight ratio of MgO/SiO2 is not lower than 1. Internal pores have a diameter not larger than 20μm and the porosity is not higher than 2%.
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