发明名称 APPARATUS AND METHOD FOR BAKING WAFER
摘要 PURPOSE: An apparatus for baking a wafer is provided to prevent a process defect caused by a wafer inaccurately placed on a heating plate by making a detecting unit using a sensor and a lift pin detect the wafer placed on the heating plate, and to prevent recurrence of a defect by readjusting a loading position of a robot. CONSTITUTION: A wafer to bake is placed on the heating plate(110). The lift pin loads/unloads the wafer to/from the heating plate, installed in the heating plate. A guide pin guides the wafer loaded to the heating plate, installed at the edge of the heating plate. A wafer detecting unit detects the wafer inaccurately loaded to the heating plate, installed in the guide pin.
申请公布号 KR20020062437(A) 申请公布日期 2002.07.26
申请号 KR20010003432 申请日期 2001.01.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SHIN, GIL HUN
分类号 H01L21/027;(IPC1-7):H01L21/027 主分类号 H01L21/027
代理机构 代理人
主权项
地址