发明名称 Method for processing by laser, apparatus for processing by laser, and three-dimensional structure
摘要 A laser processing method where laser beam for processing is irradiated on a processing object and the laser beam for processing directly removes a part of the processing object. The processing object is made of a glass substrate, metal thin film having high absorption to laser beam for processing is formed on a surface of glass substrate, into which laser beam for processing is made incident, the laser beam for processing is irradiated from a surface of metal thin film, and matter is directly removed by irradiation of laser beam onto the processing object in order to form a region finer than an irradiation region of laser beam for processing on the processing object.
申请公布号 US7482052(B2) 申请公布日期 2009.01.27
申请号 US20050174471 申请日期 2005.07.06
申请人 RICOH COMPANY, LTD.;RIKEN 发明人 YAMADA YASUFUMI;MIDORIKAWA KATSUMI;KUMAGAI HIROSHI
分类号 B32B3/00;B81C1/00;B23K26/00;B23K26/06;B23K26/073;B23K26/18;B23K26/38;C03C17/00;C03C17/06;C03C23/00;H05K1/03;H05K3/00;H05K3/02 主分类号 B32B3/00
代理机构 代理人
主权项
地址