| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a columnar metal body and a conductive structure formed by the columnar metal body excellent in contact of metal layers, easy separation of protective metal layers, secured insulation of non- patterned section, conductivity between layers, and manufacturing cost. SOLUTION: A method for forming copper columnar metal bodies 24a conductively connected to wiring layers 22 having copper pattern sections comprises the steps of: forming protective metal layers 11 by plating nickel on approximately all the surface of the wiring layers 22 including non-patterned sections; forming copper plating layers 24 on approximately all surface of the protective metal layers 11 by electrolytic plating; forming mask layers 25 on the surface where the columnar metal bodies 24a of the plating layers 24 are formed; selectively etching the plating layers 24; and removing the protective metal layers 11 covering at least the non-patterned section with the etching capable of corroding at least the protective metal layers 11. |
