| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a metal plated film whose adhesion to a metal film can be ensured (which can be applied to an additive method) without spoiling the chemical stability of a polyimide substrate, when the metal film such as a copper film of the like is precipitated on the polyimide substrate by an electroless plating method. SOLUTION: In the method for forming the metal plated film, a conductor- circuit pattern is formed on the surface of the polyimide substrate. In the method for forming the metal plated film, the surface of the polyimide substrate is treated in advance with a solution which contains an organic disulfide compound having a primary amino group or an organic thiol compound having a primary amino group under the coexistence of an alkaline substance.
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