| 摘要 |
PROBLEM TO BE SOLVED: To increase heat radiation effect in heat radiation electronic components, and, furthermore, to eliminate the need for mounting a heat radiation section and a printed circuit board for reducing a mounting process in a heat radiation structure. SOLUTION: In this heat radiation structure of the heat radiation electronic components mounted onto the printed circuit board 3 accommodated inside a chassis 1, the heat radiation section 2 is provided. The heat radiation section 2 is formed by cutting and raising one portion of the one surface of the chassis 1, and composes the heat radiation structure that is inserted into an insertion hole 12 formed on the printed circuit board 3 at a position corresponding to the heat radiation section 2 and at the same time is brought into contact with the heat radiation electronic components.
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