| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, when soldering using a high-viscosity lead-free solder material, the solder material does not reach the surface land sufficiently to become like a red-eye when a lead-leg-insertion mounting component is flow-soldered, that the dislocation or the unsoldered part of the component is generated, and that a flow soldering technique cannot be executed to a printed-wiring board. SOLUTION: The printed-wiring board is formed in such a way that the lead-leg-insertion mounting component is mounted on the printed-wiring board in which conductive parts are formed on both faces. In the soldering method, the mounting component and the conductive parts on the printed-wiring board are flow-soldered and bonded with the lead-free solder material. The printed- wiring board is flow-soldered in such a way that surface lands are plated and treated with the same lead-free solder.
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