| 摘要 |
PROBLEM TO BE SOLVED: To conduct high density mounting of a semiconductor element and high-speed signal transmission at a low cost. SOLUTION: This semiconductor device is provided with the semiconductor element 3, an input/output terminal 1j for transmitting signals to the semiconductor element 3, a plurality of power-feeding electrodes 2e for supplying power to the semiconductor element 3, and a power-feeding substrate 2, provided with at least a part of the plurality of the power feeding electrodes 2e on an outer peripheral edge. The input/output terminal 2i is provided on the power- feeding electrode 2e at the outer peripheral edge. Since the input/output terminal 2i provided on the power-feeding electrode 2e is larger than the input/output terminal 1j for transmitting the signals to the semiconductor element 3, the resistance of the input/output terminal 2i of the power-feeding substrate 2 is reduced.
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