| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin printing method by which a resin can be printed on a thin circuit board mounted with a thin IC in its opening in a uniform thickness, without producing many bubbles in the resin at the time of forming a resin layer on the surface of the circuit board. SOLUTION: After a step of mounting the IC (3) in the opening (2) of the circuit board (1) and electrically connecting the pad sections (4) of the IC (3) to the internal connecting terminal sections (5) of the board (1) by wire bonding, a screen plate (9) constituted of a mesh section (8), having a larger shape than the connecting terminal section (5) of the circuit board (1) has and a mask section (7) formed around the mesh section (8) is placed on the board (1), and a liquid resin (10) is supplied to the mask and mesh sections (7) and (8) of the plate (9). Then the resin (10) put on the plate (9) is applied to at least the internal surface of the board (1), the space section between the opening (2) of the board (1) and the IC (3), and the surface of the IC (3) via the mesh section (8) by means of a squeegee (11). |
