A printed circuit board (PCB) via (42), providing a conductor (56) extending vertically between microstrip or stripline conductors (44, 48) formed on separate layers of a PCB, includes a conductive pad (59) surrounding the conductor (56) and embedded within the PCB (40) between those PCB layers. The pad's shunt capacitance and the magnitudes of capacitances of other portions of the via (42) are sized relative to the conductor's inherent inductance to optimize frequency response characteristics of the via (42).
申请公布号
WO02058234(A2)
申请公布日期
2002.07.25
申请号
WO2002US01212
申请日期
2002.01.15
申请人
FORMFACTOR, INC.;HREISH, EMAD, B.;MILLER, CHARLES, A.