Analysis chip, e.g. for genetic analysis, has layer comprising grid of electrically connected spots and second layer comprising conductive structure of rings connected by strips, where layers are separated by insulating layers

摘要

Analysis chip comprises a support structure; a base layer; a first functional layer; a first insulating layer; a second functional layer; a second insulating layer; and optionally further functional and insulating layers. Analysis chip comprises: (a) a support structure (0); (b) a base layer (1); (c) a first functional layer (2) containing a conductive structure comprising a grid of spots which are electrically connected and can be addressed individually in series; (d) a first insulating layer (3) with cavities which correspond to the pattern of spots; (e) a second functional layer (4) containing a conductive structure made up of rings connected by strips which corresponds to the pattern of spots; (f) a second insulating layer with cavities which correspond to the pattern of spots; and optionally further functional and insulating layers as described above. Independent claims are included for: (1) a method for making the chip by: (a) coating a support with polymerizable material which is polymerized to form the base layer; (b) coating the base layer with a conductive material, especially a metal, particularly gold; (c) etching the conductive layer to produce the first functional layer; (d) coating this layer with material which is polymerized to produce the first insulating layer; (e) coating this layer with a conductive material, especially a metal, particularly gold, and etching it to produce the second functional layer; and (f) coating this layer with material which is polymerized to produce the second insulating layer; and (2) a similar process, in which the functional layers are prefabricated.