发明名称 |
Methods and devices for positioning and bonding elements in substrates |
摘要 |
Devices and techniques for placing and bonding identical elements to holes in a substrate where spacer balls and a reference surface are used to achieve the desired accuracy.
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申请公布号 |
US2002095760(A1) |
申请公布日期 |
2002.07.25 |
申请号 |
US20020101805 |
申请日期 |
2002.03.19 |
申请人 |
TERASTOR CORPORATION |
发明人 |
BERG JOHN;KINDLER DAVID J.;KENT DAVID;BUSWELL DAVID |
分类号 |
B23P19/12;H01L21/00;H01L21/68;(IPC1-7):B25B27/14 |
主分类号 |
B23P19/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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