APPARATUS FOR FABRICATING SEMICONDUCTOR AND METHOD FOR PROCESSING WAFER OF THE SAME

摘要

PURPOSE: A method for processing a wafer of an apparatus for fabricating a semiconductor is provided to prevent a wafer from being warped by a decreased thickness of the wafer in polishing the back surface of the wafer, by installing a wafer warpage preventing plate on the wafer so that impurities cannot penetrate a surface of the wafer in the process for polishing the back surface and the wafer is not warped. CONSTITUTION: A pattern of a predetermined type is formed on one surface of the wafer(100). The wafer warpage preventing plate(110) is attached to the one surface of the wafer having the pattern so that the wafer is prevented from being warped while the impurities generated in a polishing process are prevented from penetrating the pattern. The other surface of the wafer is polished to embody the wafer of a predetermined thickness. The wafer having the wafer warpage preventing plate is transferred to a predetermined position to attach tape to the other surface of the wafer. The wafer warpage preventing plate attached to the one surface of the wafer is separated. The wafer is sawed into individual device units.