发明名称 |
Photo-semiconductor module and method for manufacturing the same |
摘要 |
In a photo-semiconductor module of the present invention, a light-receiving photo-semiconductor device is mounted flip-chip-wise on a circuit board to then fix an optical fiber to a mounting face of the light-receiving photo-semiconductor or a back face of this mounting face, thus improving a high-frequency characteristic.
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申请公布号 |
US2002098609(A1) |
申请公布日期 |
2002.07.25 |
申请号 |
US20020046265 |
申请日期 |
2002.01.16 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
ONO MASAHIRO;ITAGAKI MINEHIRO |
分类号 |
G02B6/42;H01L21/00;H01L21/48;H01L31/0203;H01L31/062;H01L31/113;H01L33/58;H01L33/62;(IPC1-7):H01L21/00 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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