发明名称 Photo-semiconductor module and method for manufacturing the same
摘要 In a photo-semiconductor module of the present invention, a light-receiving photo-semiconductor device is mounted flip-chip-wise on a circuit board to then fix an optical fiber to a mounting face of the light-receiving photo-semiconductor or a back face of this mounting face, thus improving a high-frequency characteristic.
申请公布号 US2002098609(A1) 申请公布日期 2002.07.25
申请号 US20020046265 申请日期 2002.01.16
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 ONO MASAHIRO;ITAGAKI MINEHIRO
分类号 G02B6/42;H01L21/00;H01L21/48;H01L31/0203;H01L31/062;H01L31/113;H01L33/58;H01L33/62;(IPC1-7):H01L21/00 主分类号 G02B6/42
代理机构 代理人
主权项
地址