发明名称 |
Semiconductor device |
摘要 |
A semiconductor device mainly comprises a chip disposed on the upper surface of a substrate. The upper surface of the substrate is provided with a ground ring, a power ring, and a plurality of conductive traces arranged at the periphery of the ground ring and the power ring. The semiconductor device comprises at least a surface-mountable device connected across the ground ring and the power ring. The semiconductor device of the present invention is characterized by having at least a bonding wire formed across the surface-mountable device. The bonding wire is connected between one of the bonding pads of the chip and the power ring wherein at least one downward depression is formed in a lengthen portion at a top of the bonding wire.
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申请公布号 |
US2002096732(A1) |
申请公布日期 |
2002.07.25 |
申请号 |
US20020094464 |
申请日期 |
2002.03.11 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
LIU SHENG-TSUNG;CRUZ FRANCISCO C. |
分类号 |
H01L21/60;H01L23/50;H05K1/02;(IPC1-7):H01L31/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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