| 摘要 |
PURPOSE: To provide a semiconductor device capable of controlling the state of the formation of mount paste formed under a semiconductor chip and capable of reducing cracks generated in the semiconductor chip. CONSTITUTION: A plurality of resist materials 12 each of which is arrayed at intervals shorter than a fixed distance, the semiconductor chip 14 arranged on a substrate 11 to which the plurality of resist materials 12 are formed, and mount paste 13 being formed between the substrate 11 and the semiconductor chip 14 and bonding the substrate 11 and the semiconductor chip 14, are mounted on the substrate 11. |
