发明名称 |
Ultra-thin resist coating quality by increasing surface roughness of the substrate |
摘要 |
In one embodiment, the present invention relates to a method of processing a semiconductor substrate, involving the steps of providing the semiconductor substrate having an upper surface; roughening the upper surface of the semiconductor substrate so that the upper surface of the semiconductor substrate has an Rtm of about 10 Å or more; and depositing an ultra-thin photoresist on the upper surface of the semiconductor substrate, the ultra-thin photoresist having a thickness of about 2,000 Å or less.
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申请公布号 |
US6423650(B2) |
申请公布日期 |
2002.07.23 |
申请号 |
US19990371715 |
申请日期 |
1999.08.09 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
PLAT MARINA V.;LYONS CHRISTOPHER F.;TEMPLETON MICHAEL K.;SINGH BHANWAR |
分类号 |
H01L21/027;H01L21/3213;(IPC1-7):H01L21/31;H01L21/469 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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