发明名称 |
Semiconductor device and method for manufacturing the same |
摘要 |
A semiconductor device includes a semiconductor chip, a dielectric tape layer and a printed circuit board. The semiconductor chip has a pad mounting surface with a plurality of bonding pads provided thereon. The dielectric tape layer has opposite first and second adhesive surfaces. The first adhesive surface is adhered onto the pad mounting surface of the semiconductor chip. The dielectric tape layer is formed with a plurality of holes at positions registered with the bonding pads to expose the bonding pads. Each of the holes is confined by a wall that cooperates with a registered one of the bonding pads to form a contact receiving space. A plurality of conductive contacts are placed in the contact receiving spaces, respectively. The printed circuit board has a circuit layout surface adhered onto the second adhesive surface of the dielectric tape layer. The circuit layout surface is formed with circuit traces that are bonded to the conductive contacts to establish electrical connection with the bonding pads. A method for manufacturing the semiconductor device is also disclosed.
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申请公布号 |
US6420210(B2) |
申请公布日期 |
2002.07.16 |
申请号 |
US20010811795 |
申请日期 |
2001.03.19 |
申请人 |
COMPUTECH INTERNATIONAL VENTURES LIMITED |
发明人 |
SHEN MING-TUNG |
分类号 |
H01L21/60;H05K3/30;H05K3/34;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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